Charakteristika a výzvy odvětví výroby desek plošných spojů (PCB) ve východní Asii a Evropě se zaměřením na Českou republiku

This thesis examines the characteristics, challenges, and geographical shifts of the printed circuit board (PCB) industry in East Asia and Europe, with particular attention to the Czech Republic. It addresses two questions: what drove the sector's expansion in Asia and decline in Europe from 2000 to 2025, and whether Czech government support for domestic production is justified under current economic and geopolitical circumstances. The study applies a mixed-methods approach, combining quantitative analysis of trade and production data with a qualitative multiple-case study of two Czech manufacturers, drawn from semi-structured interviews. It attributes Asia's dominance to reinforcing factors: its proximity to electronics assembly, state investment, dense supplier networks, and lower labour costs. A SWOT analysis supports a qualified case for state aid, suggesting that targeted support for high-reliability capabilities is justifiable. However, broad, volume-driven spending could lead to waste and market distortions.